Integrated optical chip

Optical waveguides – Integrated optical circuit

Reexamination Certificate

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Reexamination Certificate

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07062113

ABSTRACT:
An integrated optical chip has a crystalline structure cut along parallel principal crystallographic planes and a thickness of less than 1.0 mm. An optical signal pathway is disposed generally longitudinally in one of the cut surfaces of the chip, and the chip is attached to a substrate material up to 1.0 mm thick and having similar coefficients of thermal expansion in that principal crystallographic plane. A grounding plane is disposed between the chip and substrate to provide an electrically conductive path between opposite lateral surfaces of the chip. A method of making the chip is also described.

REFERENCES:
patent: 4750800 (1988-06-01), Fournier et al.
patent: 5388170 (1995-02-01), Heismann et al.
patent: 6044184 (2000-03-01), Shafer et al.
patent: 6353690 (2002-03-01), Kulishov
patent: WO 91/03748 (1991-03-01), None
Shaw et al. “Low Cost Packaging Techniques for Active Waveguide Devices” Electronics Components and Technology Conference, 2000, May 2000, pp. 742-748.
“Electrical Loss Mechanisms In Traveling Wave LiNbO3Optical Modulators” G. K. Gopalakrishana, et al Electronics Letters, Jan. 16, 1992, vol. 28, No. 2.

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