Dynamic information storage or retrieval – Specific detail of information handling portion of system – Radiation beam modification of or by storage medium
Reexamination Certificate
2000-08-15
2003-02-18
Huber, Paul W. (Department: 2653)
Dynamic information storage or retrieval
Specific detail of information handling portion of system
Radiation beam modification of or by storage medium
C369S044120, C369S013320
Reexamination Certificate
active
06522618
ABSTRACT:
FILED OF THE INVENTION
The present invention relates to the field of optics and, more particularly, to an integrated optical apparatus providing more than one signal in separate return paths.
BACKGROUND OF THE INVENTION
Many typical computer systems include a disk drive cooperating with storage media to permit storage and retrieval of data. A typical optical disk drive includes an optical head that conventionally uses a laser to transmit light to the optical disk. Light reflected from the surface of the disk is detected by an optical detector and processed to read data from the disk. An example of such an optical head is disclosed, for example, in U.S. Pat. No. 5,204,516 titled “Planar Optical Scanning Head Having Deficiency Correcting Grating” by Opheij.
The size of the various optical head components, however, are often too large for many desired applications and many market demands. Also, as densities of integrated circuits and system boards increase, the demand for smaller components increases. Additionally, the production process for a conventional optical head requires that the laser be excited or turned-on (i.e., “active alignment”) for 25 alignment of the laser, the detector, and the optical elements. An example of active alignment processes is illustrated and described in an article
10
published in Optical Engineering (June 1989) titled “Holographic Optical Head For Compact Disk Applications” by Lee.
Unfortunately, these active alignment requirements are complex, time consuming, and relatively expensive. Further, the level of size reduction in the vertical direction of an optical head is limited. In addition, the relatively large size of the elements of an optical head which can be manipulated is determined by the need for active alignment.
SUMMARY OF THE INVENTION
With the foregoing background in mind, it is therefore an object of the present invention to provide an optical head, such as for a disk drive, and related methods which is more compact and less expensive to manufacture. It is further an object of the present invention to provide more than one signal having unique return paths.
These and other objects, advantages, and features of the present invention are provided by an integrated optical head having more than one or no optical elements in a return path from a target, thereby forming unique return paths for each beam. The integrated optical head preferably includes an optically transparent substrate having first and second faces. The substrate may include a diffractive optical element formed on a face thereof. A light source, such as a laser, is positioned adjacent the first face of the substrate to transmit light through the substrate, through the diffractive optical element, and toward a target, such as optical storage media. An optical element provided in the substrate splits the light from the light source into more than one beam. An optical detector is positioned adjacent the first surface of the substrate to detect respective beams reflected from the target and through the substrate. All of the optical elements needed to create the more than one beam, direct the more than one beam onto the target, and direct the more than one beam form the target onto said detector are on the substrate and/or any structure bonded to the substrate. Preferably, the detector includes more than one detecting element for detecting respective beams of the more than one beam.
In another embodiment, a second transparent substrate is aligned and joined to the first substrate. The second substrate may carry one or more optical elements. According to this aspect of the invention, alignment areas in the form of benches or other mechanical features may be formed in one surface and mating recesses, for example, may be formed in the other surface. Adhesive attachment areas, which may overlap the alignment areas, hold the substrates together. Alignment may also be accomplished at the wafer level by having the elements of each die accurately placed using photolithography to accurately align the two wafers. The assembled dies can then be diced without the individual alignment means or steps being required for connecting the first and second substrates.
These and other objects of the present invention will become more readily apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples are given by way of illustration only and are directed to the preferred embodiments of the present invention, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.
REFERENCES:
patent: 4626103 (1986-12-01), Feldman et al.
patent: 4636080 (1987-01-01), Feldman
patent: 4672187 (1987-06-01), Fujita et al.
patent: 4866694 (1989-09-01), Korth
patent: 4966446 (1990-10-01), Huang et al.
patent: 5025165 (1991-06-01), Chen et al.
patent: 5093879 (1992-03-01), Bregman et al.
patent: 5159473 (1992-10-01), Feldman
patent: 5168324 (1992-12-01), Hackel et al.
patent: 5170269 (1992-12-01), Lin et al.
patent: 5189485 (1993-02-01), Hackel et al.
patent: 5202775 (1993-04-01), Feldman et al.
patent: 5204516 (1993-04-01), Opheij
patent: 5229883 (1993-07-01), Jackson et al.
patent: 5237434 (1993-08-01), Feldman et al.
patent: 5309282 (1994-05-01), Feldman et al.
patent: 5317551 (1994-05-01), Shiono
patent: 5337398 (1994-08-01), Benzoni et al.
patent: 5418870 (1995-05-01), Keck et al.
patent: 5446814 (1995-08-01), Kuo et al.
patent: 5457314 (1995-10-01), Kim et al.
patent: 5499312 (1996-03-01), Hahn et al.
patent: 5499732 (1996-03-01), Mishimoto
patent: 5565574 (1996-10-01), Hoeger et al.
patent: 5583843 (1996-12-01), Horinouchi
patent: 5608233 (1997-03-01), Sahara et al.
patent: 5621715 (1997-04-01), Ohyama
patent: 5629919 (1997-05-01), Hayashi et al.
patent: 5638469 (1997-06-01), Feldman et al.
patent: 5648950 (1997-07-01), Takeda et al.
patent: 5652744 (1997-07-01), Freeman et al.
patent: 5687155 (1997-11-01), Fukakusa et al.
patent: 5712841 (1998-01-01), Opheij et al.
patent: 5805556 (1998-09-01), Lee et al.
patent: 5856048 (1999-01-01), Tahara et al.
patent: 5910940 (1999-06-01), Guerra
patent: 6005835 (1999-12-01), Tsuji et al.
patent: 0 510 750 (1992-10-01), None
patent: 0 581 519 (1994-02-01), None
patent: 2725547 (1996-03-01), None
patent: 9251663 (1997-09-01), None
patent: WO/9311453 (1993-06-01), None
Sasaki et al: “Marker Alignment Method for Passive Laser Coupling on silicon Waferboard” Ieice Transactions on Communications, vol. E79-B, No. 7, Jul. 1996, pp. 939-942, XP000628628.
Feldman Michael R.
Kathman Alan D.
Welch W. Hudson
Chu Kim-Kwok
Digital Optics Corp.
Huber Paul W.
Morse Susan S.
LandOfFree
Integrated optical apparatus and associated methods does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated optical apparatus and associated methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated optical apparatus and associated methods will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3118120