Integrated microelectromechanical wavelength selective...

Optical waveguides – With optical coupler – Particular coupling structure

Reexamination Certificate

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C385S031000, C385S037000, C385S039000, C385S046000, C385S050000

Reexamination Certificate

active

11244778

ABSTRACT:
A fully integrated microelectromechanical (MEMS) lxK wavelength selective switch (WSS) includes an array of N solid-immersion micromirrors (SIMs) and a K+1 dispersion waveguide arrays that are integrally fabricated together. In one embodiment, the WSS is fabricated in Silicon. In another embodiment, the N actuators of the SIMs are etched in the Silicon layer of a Silicon-on Insulator (SOI) wafer. Thereafter, a Silica layer is deposited on the Silicon layer and the K+1 waveguide arrays and the mirrors for the N SIMs are etched in that Silica layer. In yet another embodiment, the K+1 dispersion waveguide arrays, except for a small portion of the common confocal coupler, are fabricated using a material selected from a group including Silica, sol-gel, polymers, that is deposited on a first wafer selected from a group including Silicon, Saphire, or other glass insulator material and the remaining portion of the common confocal coupler and the N SIMs are fabricated in a Silicon wafer, and the first wafer and Silicon wafer are then butt-coupled together.

REFERENCES:
patent: 2004/0151429 (2004-08-01), Janz et al.
patent: 2004/0234201 (2004-11-01), Logvin et al.
Chi et al, “Solid-Immersion Micromirror with Enhanced Angular Deflection for Silicon-Based Planar Lightwave Circuits”, Proc. Of Optical MEMS, Aug. 2005.
“Solid-Immersion Micromirror with Enhanced Angular Deflection for Silicon-Based Planar Lightwave Circuits” by C-H. Chi et al, pubished in Proc. of Optical MEMS, Aug. 2005.
D.T.Fuchs et al., “A hybrid MEMS-waveguide wavelength selective cross-connect,” IEEE Photonics Technol.Lett., vol. 16, pp. 99-101, 2004.
C.H.Chi et al., “Integrated 1×4 WSS with on-chip MEMS mirrors,” QELS Conference, Baltimore, MD., 2005, Paper JThE58, pp. 1732-1734, IEEE 2005.

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