Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Reexamination Certificate
2004-07-02
2009-06-02
Luu, Chuong A. (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Incorporating resilient component
C438S052000, C438S054000
Reexamination Certificate
active
07541219
ABSTRACT:
A mass storage device includes a probe that has a cantilever having a first end region operatively connected to a substrate and a second end region rotated in a direction such that the second end region is opposed to the first end region. A tip is disposed on the second end region, with the tip pointing in a direction opposed to the first end region.
REFERENCES:
patent: 4268537 (1981-05-01), Goodman
patent: 4740705 (1988-04-01), Crewe
patent: 5221415 (1993-06-01), Albrecht et al.
patent: 5665648 (1997-09-01), Little
patent: 5994160 (1999-11-01), Niedermann et al.
patent: 6075585 (2000-06-01), Minne et al.
patent: 6242929 (2001-06-01), Mizuta
patent: 6245444 (2001-06-01), Marcus et al.
patent: 6291140 (2001-09-01), Andreoli et al.
patent: 6328902 (2001-12-01), Hantschel et al.
patent: 6475822 (2002-11-01), Eldridge et al.
patent: 6504152 (2003-01-01), Hantschel et al.
patent: 6520778 (2003-02-01), Eldridge et al.
patent: 6528350 (2003-03-01), Fork
patent: 2002/0197761 (2002-12-01), Patel et al.
patent: 2003/0036215 (2003-02-01), Reid
patent: 2003/0081651 (2003-05-01), Gianchandani et al.
patent: 2003/0100145 (2003-05-01), Fork
patent: 2003/0235272 (2003-12-01), Appleby et al.
Vettiger, P. et al., “The ‘Millipede’—More than one thousand tips for future AFM data storage,” International Business Machines (IBM), J. Res. Develop., vol. 44, No. 3, pp. 323-340 (May 2000).
Abbott Kenneth J.
Harmon John Paul
Milligan Donald J.
Lenart, Esq. Robert P.
Luu Chuong A.
Pietragallo Gordon Alfano Bosick & Raspanti, LLP
Queen, II Benjamin T.
Seagate Technology LLC
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