Measuring and testing – Surface and cutting edge testing
Reexamination Certificate
2006-01-17
2006-01-17
Williams, Hezron (Department: 2856)
Measuring and testing
Surface and cutting edge testing
C073S105000, C250S306000, C250S307000, C250S492200, C356S634000, C356S635000, C356S636000
Reexamination Certificate
active
06986280
ABSTRACT:
A surface analyzing system including in one system both an integrating optical instrument, such as a scatterometer, and individual-feature-measuring instrument, such as a scanning probe microscope or a beam imaging system, for example, a scanning electron microscope. In a preferred embodiment, the two instruments are capable of characterizing a wafer held on a common stage. The stage may be movable a predetermined displacement to allow the same area of the wafer to be characterized by a scatterometer at one position of the stage and to be characterized by the scanning probe microscope or beam imaging system. The scatterometer can rapidly measure wafers to indicate whether a problem exists, and the scanning probe microscope can perform detailed measurements on wafers flagged by the scatterometer.
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Fei Company
Rogers David A.
Scheinberg Michael O.
Williams Hezron
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