Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2006-03-15
2008-09-02
Walberg, Teresa J (Department: 3744)
Heat exchange
With retainer for removable article
Electrical component
C165S104190
Reexamination Certificate
active
07418996
ABSTRACT:
An integrated liquid cooling system (100) includes a heat absorbing member (10), a heat dissipating member (20) and a pump (15). The heat absorbing member defines therein a fluid flow channel (115) for passage of a coolant. The heat dissipating member is mounted to and maintained in fluid communication with the heat absorbing member. The pump is received in the heat dissipating member and is maintained in fluid communication with the heat absorbing member and the heat dissipating member. The pump is configured for driving the coolant to circulate through the heat absorbing member and the heat dissipating member. The components (i.e., the heat absorbing member, the heat dissipating member and the pump) of the liquid cooling system are combined together to form an integrated structure without utilizing any separate connecting pipes.
REFERENCES:
patent: 6019165 (2000-02-01), Batchelder
patent: 7149087 (2006-12-01), Wilson et al.
patent: 7204299 (2007-04-01), Bhatti et al.
patent: 2006/0133039 (2006-06-01), Belady
patent: 2006/0213645 (2006-09-01), Wintersteen et al.
patent: 2007/0000648 (2007-01-01), Crocker et al.
patent: 2007/0039719 (2007-02-01), Eriksen
patent: 2007/0115634 (2007-05-01), Laing
patent: 2622658 (2004-06-01), None
patent: 2622866 (2004-06-01), None
patent: 2664194 (2004-12-01), None
Hou Chuen-Shu
Liu Tay-Jian
Tung Chao-Nien
Yang Chih-Hao
Foxconn Technology Co., Ltd.
Hsu Winston
Walberg Teresa J
LandOfFree
Integrated liquid cooling system for electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated liquid cooling system for electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated liquid cooling system for electronic components will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3982834