Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
2007-01-02
2007-01-02
Duong, Tho (Department: 3753)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S080400, C361S699000
Reexamination Certificate
active
10946702
ABSTRACT:
A liquid cooling system includes a container (10) defining communicable first and second chambers (125a,125b) therein, a pump (15) mounted on the container and having an entrance port (152) in flow communication with the second chamber, and an exit port (150) in flow communication with the first chamber so that the pump, the first chamber, and the second chamber together form a loop for circulation of coolant, and a heat dissipation unit (2) located at the loop for cooling the coolant.
REFERENCES:
patent: 3524497 (1970-08-01), Chu et al.
patent: 5005640 (1991-04-01), Lapinski et al.
patent: 5309319 (1994-05-01), Messina
patent: 5349831 (1994-09-01), Daikoku et al.
patent: 5731954 (1998-03-01), Cheon
patent: 5763951 (1998-06-01), Hamilton et al.
patent: 5964206 (1999-10-01), White et al.
patent: 6019165 (2000-02-01), Batchelder
patent: 6702002 (2004-03-01), Wang
patent: 6745823 (2004-06-01), Brost
patent: 6778394 (2004-08-01), Oikawa et al.
patent: 6860242 (2005-03-01), Schenk
patent: ZL98248834.3 (1999-11-01), None
patent: ZL99210734.2 (2000-04-01), None
Lai Cheng-tien
Lee Hsieh Kun
Zhou Shi-Wen
Chung Wei Te
Duong Tho
Foxconn Technology Co., Ltd.
Fu Zhun Precision Ind. (Shenzhen) Co., Ltd.
LandOfFree
Integrated liquid cooling system for electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated liquid cooling system for electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated liquid cooling system for electronic components will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3725743