Integrated lead suspension for high density drive

Details Integrated lead suspension for high density drive Integrated lead suspension for high density drive

2005-11-15

2005-11-15

Castro, Angel (Department: 2653)

Dynamic magnetic information storage or retrieval

Head mounting

Disk record

Reexamination Certificate

active

06965501

ABSTRACT:
The integrated lead suspension assembly comprises several improvements. An oversized terminating pad for the electrical traces and a smaller adjacent insulation layer on the flexure assembly enable laser solder ball bonding of the pads to the read/write terminal contacts on the slider without clamping operation. Consequently, the tip of the load beam can be made narrow for a structure that provides for head loading and unloading functions, which improves the dynamic performance of the suspension assembly. The flexure assembly is configured such that it requires no permanent bending in its forming process, and any permanent bending required is done to the load beam. The limiter that limits the travel of the flexure assembly is formed on the load beam and it is bent to the functional position only after attachment of the flexure assembly to the load beam. The limiter is configured and positioned at the leading edge side of the slider to optimize the unloading process and to minimize the possibility of disengagement of the limiter and the flexure assembly during high shock environment. Asymmetric backing branches are provided for the read and write traces in the flexure assembly located at the hinge area of the load beam, the widths of which are sized to optimize the dynamic signal performance of the read and write traces without impact on the vertical stiffness of the suspension. Low profile flanges at 30°–60° that bend from the plane of the load beam are provided along the edges of the load beam to optimize bending stiffness and flow induced vibration. Dimples are provided along the load beam to facilitate insertion of a plastic head separation tool.

REFERENCES:
patent: 4761699 (1988-08-01), Ainslie et al.
patent: 5737152 (1998-04-01), Balakrishnan
patent: 5739982 (1998-04-01), Arya et al.
patent: 5771136 (1998-06-01), Girard
patent: 5812342 (1998-09-01), Khan et al.
patent: 5812344 (1998-09-01), Balakrishnan
patent: 5864445 (1999-01-01), Bennin et al.
patent: 5877921 (1999-03-01), Coon et al.
patent: 5877923 (1999-03-01), Khan et al.
patent: 5892637 (1999-04-01), Brooks, Jr. et al.
patent: 5894381 (1999-04-01), Allen et al.
patent: 5930079 (1999-07-01), Vera et al.
patent: 5982584 (1999-11-01), Bennin et al.
patent: 5986853 (1999-11-01), Simmons et al.
patent: 6014290 (2000-01-01), Supramaniam et al.
patent: 6018871 (2000-02-01), Khan et al.
patent: 6021022 (2000-02-01), Himes et al.
patent: 6043955 (2000-03-01), Khan et al.
patent: 6046883 (2000-04-01), Miller
patent: 6137657 (2000-10-01), Coon et al.
patent: 6151197 (2000-11-01), Larson et al.
patent: 6172853 (2001-01-01), Davis et al.
patent: 6181525 (2001-01-01), Carlson
patent: 6191915 (2001-02-01), Takagi et al.
patent: 6195237 (2001-02-01), Perez
patent: 6233121 (2001-05-01), Pan
patent: 6243235 (2001-06-01), Fu et al.
patent: 6266212 (2001-07-01), Coon
patent: 6292333 (2001-09-01), Blumentritt et al.
patent: 6320729 (2001-11-01), Coon
patent: 6367145 (2002-04-01), Coon
patent: 6388843 (2002-05-01), Takagi et al.
patent: 6424498 (2002-07-01), Patterson et al.
patent: 6424499 (2002-07-01), Balakrishnan et al.
patent: 6426851 (2002-07-01), Perez
patent: 6445546 (2002-09-01), Coon
patent: 6538850 (2003-03-01), Hadian et al.
patent: 6611402 (2003-08-01), Mangold
patent: 6667856 (2003-12-01), Danielson et al.
patent: 2002/0051324 (2002-05-01), Nojima
patent: 2002/0075602 (2002-06-01), Mangold et al.
patent: 08045207 (1996-02-01), None
patent: 10055636 (1998-02-01), None
patent: 11007741 (1999-01-01), None
patent: 2000076810 (2000-03-01), None
patent: 2000 195209 (2000-07-01), None
patent: 2000195209 (2000-07-01), None
patent: 2000348454 (2000-12-01), None

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