Integrated lead suspension and method of construction

Details Integrated lead suspension and method of construction Integrated lead suspension and method of construction

2006-01-10

2006-01-10

Cuneo, Kamad (Department: 2841)

Dynamic magnetic information storage or retrieval

Head mounting

Disk record

C174S260000, C174S261000

Reexamination Certificate

active

06985335

ABSTRACT:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

REFERENCES:
patent: 4940181 (1990-07-01), Juskey, Jr. et al.
patent: 5737152 (1998-04-01), Balakrishnan
patent: 5805381 (1998-09-01), Resh
patent: 5982584 (1999-11-01), Bennin et al.
patent: 6316737 (2001-11-01), Evans et al.
patent: 6330132 (2001-12-01), Honda
patent: 6349017 (2002-02-01), Schott
patent: 6351353 (2002-02-01), Sluzewski et al.
patent: 6543677 (2003-04-01), Pattanaik et al.
patent: 6683387 (2004-01-01), Brownfield
patent: 57152130 (1982-09-01), None
patent: 01283841 (1989-11-01), None
patent: 03-255696 (1991-11-01), None
patent: 04-044292 (1992-02-01), None
patent: 09-148721 (1997-06-01), None
patent: 2002-025025 (2002-01-01), None
patent: 2002-251705 (2002-09-01), None
U.S. Appl. No. 10/963,704, filed Oct. 13, 2004.
Ahmad, S.S.; “Impact of residue on AI/Si pads on gold bonding”; Electronics Components Conference, 1988; Proceedings of the 38th, 9-11 May 1988; pp. 534-538.
Cher Ming Tan, Er, E. & Younan Hua, Chai, V.; “Failure analysis of bond pad metal peeling using FIB and AFM”; IEEE Transactions on vol. 21 Issue: Dec. 4, 1998; pp. 585-591.

Affiliated with

Also associated with

Rating

Integrated lead suspension and method of construction does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated lead suspension and method of construction, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated lead suspension and method of construction will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3570741