Integrated lead suspension and method of construction

Details Integrated lead suspension and method of construction Integrated lead suspension and method of construction

2005-04-12

2005-04-12

Cuneo, Kamand (Department: 2841)

Dynamic magnetic information storage or retrieval

Head mounting

Disk record

C174S260000, C174S261000

Reexamination Certificate

active

06879465

ABSTRACT:
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

REFERENCES:
patent: 4940181 (1990-07-01), Juskey et al.
patent: 5737152 (1998-04-01), Balakrishnan
patent: 6316737 (2001-11-01), Evans et al.
patent: 6330132 (2001-12-01), Honda
patent: 6349017 (2002-02-01), Schott
patent: 6683387 (2004-01-01), Brownfield

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