Integrated interconnect arrangement

Details Integrated interconnect arrangement Integrated interconnect arrangement

2003-03-19

2009-06-23

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S531000, C257S664000, C257S758000, C257SE23170

Reexamination Certificate

active

07550854

ABSTRACT:
An explanation is given of an integrated interconnect arrangement having a plurality of interconnects that cross over one another at two crossover sections. By virtue of this measure, it is possible to achieve a uniform current flow in all three interconnects even at very high frequencies.

REFERENCES:
patent: 5559360 (1996-09-01), Chiu et al.
patent: 5962945 (1999-10-01), Krenzer et al.
patent: 6049308 (2000-04-01), Hietala et al.
patent: 6124624 (2000-09-01), Van Roosmalen et al.
patent: 6388188 (2002-05-01), Harrison
patent: 6987307 (2006-01-01), White et al.
patent: 197 27 758 (1998-10-01), None
patent: WO 98/43258 (1998-10-01), None
patent: WO 03/005381 (2003-01-01), None

Affiliated with

Also associated with

Rating

Integrated interconnect arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated interconnect arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated interconnect arrangement will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4067206