Integrated interconnect and method of manufacture therefor

Details Integrated interconnect and method of manufacture therefor Integrated interconnect and method of manufacture therefor

2006-08-08

2006-08-08

Cao, Allen (Department: 2627)

Dynamic magnetic information storage or retrieval

Head mounting

For adjusting head position

Reexamination Certificate

active

07088559

ABSTRACT:
An integrated interface structure for a nested body to provide an electrical connection. The interface structure includes nested bond pads which electrically interface with leads. The nested bond pads are fabricated on a microstructure to provide an interface to drive circuitry for transducer elements of a slider or head supported by the microstructure.

REFERENCES:
patent: 4477828 (1984-10-01), Scherer
patent: 5243756 (1993-09-01), Hamburgen et al.
patent: 5923955 (1999-07-01), Wong
patent: 5959808 (1999-09-01), Fan et al.
patent: 6078476 (2000-06-01), Magee et al.
patent: 6156652 (2000-12-01), Michalicek
patent: 6198145 (2001-03-01), Ferrari et al.
patent: 6249064 (2001-06-01), Bradbury
patent: 6262868 (2001-07-01), Arya et al.
patent: 6275320 (2001-08-01), Dhuler et al.
patent: 6282066 (2001-08-01), Bonin
patent: 6286935 (2001-09-01), Silverbrook
patent: 6288985 (2001-09-01), Jordache et al.
patent: 6297936 (2001-10-01), Kant et al.
patent: 6351354 (2002-02-01), Bonin
patent: 6395582 (2002-05-01), Sohn et al.
patent: 6429028 (2002-08-01), Young et al.
patent: 6465882 (2002-10-01), Cohn et al.
patent: 6574077 (2003-06-01), Crane et al.
patent: 6611399 (2003-08-01), Mei et al.
patent: 6624981 (2003-09-01), Vigna
patent: 6665151 (2003-12-01), Bonin et al.
patent: 6833978 (2004-12-01), Shum et al.
patent: 2003/0157426 (2003-08-01), Jordan et al.
patent: 2005/0084998 (2005-04-01), Horning et al.
patent: 361198656 (1986-09-01), None
patent: 363173332 (1988-07-01), None
patent: 403262122 (1991-11-01), None

Affiliated with

Also associated with

Rating

Integrated interconnect and method of manufacture therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated interconnect and method of manufacture therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated interconnect and method of manufacture therefor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3631584