Integrated injection logic using oxide isolation

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357 46, 357 50, 357 59, H01L 2704

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039785157

ABSTRACT:
An integrated injection logic circuit cell structure and its fabrication are simplified. A pattern of oxide isolation regions is used to define, at least partially, the introduction of two types of impurities in such a way as to reduce the number of masking steps. Certain of these oxide regions do not penetrate through the conventional epitaxial layer, leaving a lateral buried path to serve as the base of a lateral injection transistor. A pattern of polycrystalline silicon containing impurities is used both as a diffusion source and an interconnection.

REFERENCES:
patent: 2663806 (1953-12-01), Darlington
patent: 3519901 (1970-07-01), Bean et al.
patent: 3534234 (1970-10-01), Clevenger
patent: 3664896 (1972-05-01), Duncan
patent: 3736477 (1973-05-01), Berger et al.
Evans et al., "Oxide-Isolated Monolithic Technology," IEEE Journal of Solid-State Circuits, Oct. 1973, pp. 373-379.
Cousand, "A Very High Speed, Low Power Bipolar . . . ," IEEE Int. Electron Dev. Meeting, Washington, D.C., Dec. 1973, Technical Digest pp. 35-37, paper 3-1.

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