Integrated inductor

Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil

Reexamination Certificate

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Reexamination Certificate

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07612645

ABSTRACT:
An integrated inductor formed on a substrate comprises a metal layer pattern, a via layer pattern overlapping and electrically connected to the metal layer, and a redistribution layer pattern overlapping and electrically connected to the via layer. The metal layer pattern, the via layer pattern, and the redistribution layer pattern are a coil pattern.

REFERENCES:
patent: 5545916 (1996-08-01), Koullias
patent: 6566731 (2003-05-01), Ahn et al.
patent: 2001/0028098 (2001-10-01), Liou
patent: 2002/0008301 (2002-01-01), Liou et al.
patent: 2005/0093668 (2005-05-01), Bueyuektas et al.
patent: 2005/0124131 (2005-06-01), Hweing et al.
patent: 2006/0125589 (2006-06-01), Tamata et al.
patent: 2006/0158302 (2006-07-01), Jeong et al.
patent: 9162354 (1997-06-01), None
patent: 2004119489 (2004-04-01), None
patent: 2005210121 (2005-08-01), None
patent: 2005-0032009 (2005-04-01), None
Chinese language office action. No Date.
English language translation of abstract of JP 2004119489.
English language translation of abstract of JP 2005210121.
English language translation of abstract of JP 9162354. Jun. 20, 1997.

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