Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-06-02
2000-09-19
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361687, 361688, 361800, 361816, 361818, 361819, H05K 500, H05K 700, H05K 720, H05K 900, H05K 714
Patent
active
061221678
ABSTRACT:
A computer system includes a motherboard mounted in a chassis. An EMI shield member is mounted on the motherboard. A processor module is connected to the motherboard and has peripheral edge contact with the EMI shield member. A cap member is mounted on the processor module and is engaged with the EMI shield member. A heat sink is connected to the cap member. A heat pipe has a first end attached to the cap member and a second end attached to the heat sink. A fan is mounted in the chassis adjacent the heat sink for drawing cooling air across the heat sink.
REFERENCES:
patent: 4675783 (1987-06-01), Murase et al.
patent: 5030793 (1991-07-01), McCarthy
patent: 5175613 (1992-12-01), Barker, III et al.
patent: 5185691 (1993-02-01), Korinsky
patent: 5568360 (1996-10-01), Penniman et al.
patent: 5715139 (1998-02-01), Nakajima
patent: 5740013 (1998-04-01), Roesner et al.
patent: 5784256 (1998-06-01), Nakamura et al.
Penniman Mark B.
Smith Russell
Steigerwald Todd
Bui Tung Minh
Dell USA L.P.
Picard Leo P.
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