Integrated hybrid cooling with EMI shielding for a portable comp

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361687, 361688, 361800, 361816, 361818, 361819, H05K 500, H05K 700, H05K 720, H05K 900, H05K 714

Patent

active

061221678

ABSTRACT:
A computer system includes a motherboard mounted in a chassis. An EMI shield member is mounted on the motherboard. A processor module is connected to the motherboard and has peripheral edge contact with the EMI shield member. A cap member is mounted on the processor module and is engaged with the EMI shield member. A heat sink is connected to the cap member. A heat pipe has a first end attached to the cap member and a second end attached to the heat sink. A fan is mounted in the chassis adjacent the heat sink for drawing cooling air across the heat sink.

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patent: 5715139 (1998-02-01), Nakajima
patent: 5740013 (1998-04-01), Roesner et al.
patent: 5784256 (1998-06-01), Nakamura et al.

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