Integrated hot spot detector for design, analysis, and control

Thermal measuring and testing – Temperature measurement – Composite temperature-related paramenter

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374137, 374166, G01K3/14;7/00

Patent

active

059020440

ABSTRACT:
A matrix of thermal sensors is provided for accurately evaluating the thermal characteristics of an integrated circuit. The integrated circuit is evenly divided into a plurality of sectors in which a thermal comparison to a known thermal mass will be performed. Each sector includes at least one dual cell comprising a local thermal sensor for providing an output corresponding to a local temperature of the integrated circuit in that sector, and a background thermal sensor. The outputs of selective ones of the background thermal sensors are combined to provide a signal corresponding to a background temperature of the integrated circuit. A decoder/enabler arrangement is used to selectively gate the output of a specific local thermal sensor in a sector to a difference circuit where it is compared to the collective output of selected ones of the background sensors to generate a thermal measurement of the sector under test.

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