Communications: radio wave antennas – Antennas – With coupling network or impedance in the leadin
Reexamination Certificate
2008-06-30
2010-12-14
Nguyen, Hoang V (Department: 2821)
Communications: radio wave antennas
Antennas
With coupling network or impedance in the leadin
C343S7000MS
Reexamination Certificate
active
07852281
ABSTRACT:
Embodiments of integrated high performance package systems for millimeter-wave array applications are described herein. Other embodiments may be described and claimed.
REFERENCES:
patent: 4316194 (1982-02-01), De Santis et al.
patent: 2008/0159364 (2008-07-01), Rofougaran
patent: 2009/0231225 (2009-09-01), Choudhury et al.
Choudhury, Debabani, et al, U.S. Appl. No. 11/874,899, filed Oct. 17, 2007.
Suh, Seong-Youp, et al, U.S. Appl. No. 11/693,013, filed Mar. 29, 2007.
Choudhury, Debabani, U.S. Appl. No. 11/807,987, filed May 31, 2007.
Choudhury, Debabani; “Wireless Antenna Array System Architecture and Methods to Achieve 3D Beam Coverage”; U.S. Appl. No. 12/215,542, filed Jun. 27, 2008.
Gaucher, B., et al “MM-Wave Transceivers Using Sige HBT Technology”, IEEE 2004, pp. 81-84.
Lee, Johg-Hoon, et al Highly Integrated Millimeter-Wave Passive Components Using 3-D LTCC System-On-Package (SOP) Technology, IEEE vol. 53, No. 6, Jun. 2005, pp. 2220-2229.
Tentzeris, Manos M., “3-D-Integrated RF and Millimeter-Wave Funtions and Modules Using Liquid Crystal Polymer (LCP) System-On-Package Technology”, IEEE vol. 27, No. 2, May 2004, pp. 332-340.
Intel Corporation
Lane Scott M.
Nguyen Hoang V
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