Integrated heatsink and heatpipe

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257722, 174 152, 16510433, H01L 2334, H01B 734, F28D 1500

Patent

active

06163073&

ABSTRACT:
A heatsink mounted to an electronic device having an area substantially greater than that of the device includes a heatpipe in the heatsink for transferring heat within the heatsink to reduce thermal gradients therein.

REFERENCES:
patent: 4204246 (1980-05-01), Arii et al.
patent: 4727455 (1988-02-01), Neidig et al.
patent: 4833567 (1989-05-01), Saaski et al.
patent: 5115858 (1992-05-01), Fitch et al.
patent: 5181167 (1993-01-01), Davidson et al.
patent: 5199483 (1993-04-01), Bahng
patent: 5268812 (1993-12-01), Conte
patent: 5309457 (1994-05-01), Minch
patent: 5329993 (1994-07-01), Ettehadieh
patent: 5355942 (1994-10-01), Conte
patent: 5424916 (1995-06-01), Martin
patent: 5453911 (1995-09-01), Wolgemuth
patent: 5491362 (1996-02-01), Hamzehdoost
patent: 5495889 (1996-03-01), Dubelloy
patent: 5725050 (1998-03-01), Meyer, IV et al.
patent: 5826645 (1998-10-01), Meyer, IV et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated heatsink and heatpipe does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated heatsink and heatpipe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated heatsink and heatpipe will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-273202

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.