Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-01-22
2009-02-03
Malsawma, Lex (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257SE23080
Reexamination Certificate
active
07485495
ABSTRACT:
Integrated heat spreader and die coupled with solder in a manner forming an intermetallic compound having a higher liquidus temperature than the liquidus temperature of the solder used to create the intermetallic compound are described herein.
REFERENCES:
patent: 5354717 (1994-10-01), Pollock et al.
patent: 5587882 (1996-12-01), Patel
patent: 5926371 (1999-07-01), Dolbear
patent: 5931222 (1999-08-01), Toy et al.
patent: 6008536 (1999-12-01), Mertol
patent: 6462410 (2002-10-01), Novotny et al.
patent: 6504243 (2003-01-01), Andric et al.
patent: 6518666 (2003-02-01), Ikeda
patent: 6656770 (2003-12-01), Atwood et al.
patent: 6724078 (2004-04-01), Sur et al.
patent: 6748350 (2004-06-01), Rumer et al.
patent: 6790709 (2004-09-01), Dias et al.
patent: 6867978 (2005-03-01), Whittenburg et al.
patent: 6924170 (2005-08-01), Ravi et al.
patent: 2001/0026957 (2001-10-01), Atwood et al.
patent: 2003/0117343 (2003-06-01), Kling
patent: 2004/0190263 (2004-09-01), Jadhav et al.
patent: 2005/0040518 (2005-02-01), Brandenburg et al.
Jadhav Susheel G.
Renavikar Mukul P.
Intel Corporation
Malsawma Lex
Schwabe Williamson & Wyatt P.C.
LandOfFree
Integrated heat spreader with intermetallic layer and method... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated heat spreader with intermetallic layer and method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated heat spreader with intermetallic layer and method... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4071534