Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-02-27
2007-02-27
Malsawma, Lex H. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23109
Reexamination Certificate
active
11094893
ABSTRACT:
Integrated heat spreader and die coupled with solder in a manner forming an intermetallic compound having a higher liquidus temperature than the liquidus temperature of the solder used to create the intermetallic compound are described herein.
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Jadhav Susheel G.
Renavikar Mukul P.
Intel Corporation
Malsawma Lex H.
Schwabe Williamson & Wyatt P.C.
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