Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-07-03
2007-07-03
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C361S719000, C257S706000, C257S712000
Reexamination Certificate
active
11105061
ABSTRACT:
Integrated heat spreader and die coupled with solder. The heat spreader may have solder reservoirs. Additionally, the heat spreader and die may be coupled during a reflow process where the gaseous pressure surrounding the integrated heat spreader and the die is varied.
REFERENCES:
patent: 4561011 (1985-12-01), Kohara et al.
patent: 5396403 (1995-03-01), Patel
patent: 5410449 (1995-04-01), Brunner
patent: 5587882 (1996-12-01), Patel
patent: 5821161 (1998-10-01), Covell et al.
patent: 5926371 (1999-07-01), Dolbear
patent: 6281573 (2001-08-01), Atwood et al.
patent: 6292369 (2001-09-01), Daves et al.
patent: 6362435 (2002-03-01), Downey et al.
patent: 6656770 (2003-12-01), Atwood et al.
patent: 6724078 (2004-04-01), Sur et al.
patent: 6822331 (2004-11-01), Eytcheson
patent: 6903271 (2005-06-01), Pearson et al.
patent: 7119432 (2006-10-01), Desai et al.
patent: 2004/0190263 (2004-09-01), Jadhav et al.
Fitzgerald Thomas J.
Jadhav Susheel G.
Renavikar Mukul P.
Chervinsky Boris
Intel Corporation
Schwabe Williamson & Wyatt P.C.
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