Integrated heat spreader and method for using

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S707000, C361S719000, C257S706000, C257S712000

Reexamination Certificate

active

11105061

ABSTRACT:
Integrated heat spreader and die coupled with solder. The heat spreader may have solder reservoirs. Additionally, the heat spreader and die may be coupled during a reflow process where the gaseous pressure surrounding the integrated heat spreader and the die is varied.

REFERENCES:
patent: 4561011 (1985-12-01), Kohara et al.
patent: 5396403 (1995-03-01), Patel
patent: 5410449 (1995-04-01), Brunner
patent: 5587882 (1996-12-01), Patel
patent: 5821161 (1998-10-01), Covell et al.
patent: 5926371 (1999-07-01), Dolbear
patent: 6281573 (2001-08-01), Atwood et al.
patent: 6292369 (2001-09-01), Daves et al.
patent: 6362435 (2002-03-01), Downey et al.
patent: 6656770 (2003-12-01), Atwood et al.
patent: 6724078 (2004-04-01), Sur et al.
patent: 6822331 (2004-11-01), Eytcheson
patent: 6903271 (2005-06-01), Pearson et al.
patent: 7119432 (2006-10-01), Desai et al.
patent: 2004/0190263 (2004-09-01), Jadhav et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated heat spreader and method for using does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated heat spreader and method for using, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated heat spreader and method for using will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3798995

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.