Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-06-20
2008-12-09
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S707000, C257S712000, C257S713000
Reexamination Certificate
active
07462934
ABSTRACT:
An integrated heat sink comprises a plurality of heat sink portions. The integrated heat sink provides efficient transfer of heat from a non-planar surface. In an example configuration two heat sinks are integrated to provide a thermal solution for dual bare die silicon circuits on a common substrate. One of the heat sinks in the integrated heat sink is compressively coupled to an integrated circuit via an integral spring assembly. The spring assembly pushes one of the heat sinks against one of the integrated circuits while allowing the other heat sink to remain positioned against the other integrated circuit. The integrated heat sink compensates for variations in circuit height. The integrated heat sink obviates the need for independent heat sinks for transferring heat from a non-planar surface.
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Microsoft Corporation
Parekh Nitin
Woodcock & Washburn LLP
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