Integrated heat removal and vibration damping for avionic...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S080400, C165S104330, C174S015200

Reexamination Certificate

active

10930127

ABSTRACT:
An electronic equipment rack system supports a printed wire board (PWB) assembly having a structural stiffener with a heat pipe mounted therein. The heat pipe is mounted within the structural stiffener directly adjacent the printed wire board to conduct thermal energy away from the electronic components on the printed wire board.

REFERENCES:
patent: 4153225 (1979-05-01), Paulsen
patent: 5019939 (1991-05-01), Reimer
patent: 5262587 (1993-11-01), Moser
patent: 5414592 (1995-05-01), Stout et al.
patent: 5424916 (1995-06-01), Martin
patent: 5485671 (1996-01-01), Larson et al.
patent: 6008987 (1999-12-01), Gale et al.
patent: 6212074 (2001-04-01), Gonsalves et al.
patent: 6339211 (2002-01-01), Foote et al.
patent: 6385044 (2002-05-01), Colbert et al.
patent: 6839235 (2005-01-01), St. Louis et al.
patent: 6873528 (2005-03-01), Hulan et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated heat removal and vibration damping for avionic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated heat removal and vibration damping for avionic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated heat removal and vibration damping for avionic... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3789899

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.