Integrated heat pipe and circuit board structure

Details Integrated heat pipe and circuit board structure Integrated heat pipe and circuit board structure

1992-09-29

1994-02-01

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 152, 16510433, 257715, 361796, H05K 720

Patent

active

052837157

ABSTRACT:
A heat pipe structure is incorporated directly into the metal baseplate of a circuit card thereby eliminating thermal contact resistance between the baseplate and the heat pipe assembly. Components are mounted on a copper circuit layer bonded to a dielectric layer in a first portion of the baseplate with a second portion of the baseplate/heat pipe assembly extending into a heat sink/cold plate condensing area for removal of heat generated in the component portion.

REFERENCES:
patent: 4327399 (1982-04-01), Sasaki et al.
patent: 4631636 (1986-12-01), Andrews
patent: 4706164 (1987-11-01), L'Henaff et al.
patent: 4718163 (1988-01-01), Berland et al.
patent: 4727455 (1988-02-01), Neidig et al.
patent: 4739443 (1988-04-01), Singhdeo
patent: 4774630 (1988-09-01), Reisman et al.
patent: 4931905 (1990-06-01), Cirrito
patent: 5179500 (1993-01-01), Koubek
Anacker, "Liquid Cooling . . . Chips", IBM Tech Discl Bull vol. 20 No. 9 Feb. 1978, p. 3742.
Kerjilian, "Heat-Pipe . . . Package", IBM Tech Discl Bull vol. 18 No. 12 May 1976, p. 3982.

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