Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
2003-09-16
2004-08-24
Flanigan, Allen J. (Department: 3753)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S104260, C165S121000, C165S185000, C361S697000, C361S700000
Reexamination Certificate
active
06779595
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to an integrated heat dissipation apparatus and, more particularly, to an integrated heat dissipation apparatus combining heat pipe technique to effectively dissipate heat generated by heat generating electronic devices, such that the heat generating electronic devices can operate normally under a uniform and constant temperature.
The enhancement of computer industry has developed various kinds of high-precision electronic devices. With the technique advancement of the electronic devices, functionalities and operation speed are continuously improved; and consequently, a great amount of heat is generated thereby. Therefore, how to effectively dissipate heat generated by these high-precision electronic devices has become a major topics for research and development people in the industry.
FIG. 1
shows a conventional heat dissipation apparatus
1
a,
which is mounted on heat generating electronic device such as a central processing unit (CPU)
2
a
. The heat dissipation apparatus
1
a
includes a heat sink
10
a
and a fan
11
a
mounted on the heat sink
10
a.
The heat sink
10
a
includes a substrate
100
a
attached to an upper surface of the central processing unit
2
a.
A plurality of fins
101
a
is formed on the substrate
100
a.
A channel
102
a
is formed between every pair of neighboring fins
101
a
for accommodating the heat flow generated by the central processing unit
2
a.
The fan
11
a
is used to blow a cool air flow into the channels
102
a,
such that the heat flow accumulated in the channels
102
a
can be cooled down and circulated. Therefore, the central processing unit
2
a
can operate normally under an allowable temperature.
The above heat dissipation apparatus
1
a
expels heat generated by the central processing unit
2
a
by a conventional way, that is, the heat is absorbed by the heat sink
10
a
and the heat flow generated thereby is accumulated in the channels
102
a
before being dissipated. For those electronic devices of which the generated heat is greatly increased, such heat dissipation apparatus cannot provide an instantaneous cooling effect and provides insufficient heat dissipation effect to the electronic devices.
BRIEF SUMMARY OF THE INVENTION
The present invention provides an integrated heat dissipation apparatus which uses a heat pipe connected to a thermal conductor to instantly dissipate heat generated by an electronic device to a distal end of the heat pipe. Therefore, the electronic device is remote from the dynamic heat generated thereby to prevent from affecting the normal functional operation thereof. In addition, two heat dissipating elements are incorporated to provide a primary path and a secondary path for heat dissipation. A fan is also used to generate a circulating air flow for dissipating the heat. Therefore, the electronic device can perform normal functional operation under a uniform and constant temperature.
The integrated heat dissipation apparatus provided by the present invention includes a first heat dissipating element, a second heat dissipating element, a thermal conductive heat sink, and at least one heat pipe. The heat sink includes a connecting surface and a thermal conductive surface opposing to the connecting surface. The first heat dissipating element is mounted to the thermal conductive surface, while the connecting surface further comprises a plurality of thermal conductors mounted thereon. The thermal conductors have thermal conductivity larger than that of the thermal conductive heat sink. The heat pipe has a first end serially connected to the second heat dissipation pipe and a second end extending to connect with the thermal conductors. Thereby, a majority portion of the heat can be carried by the heat pipe and dissipated by the second heat dissipating element, while the first heat dissipating element continues dissipating the remaining heat of the thermal conductive heat sink.
REFERENCES:
patent: 5216580 (1993-06-01), Davidson et al.
patent: 5959837 (1999-09-01), Yu
patent: 6102110 (2000-08-01), Julien et al.
patent: 6122169 (2000-09-01), Liu et al.
patent: 6125035 (2000-09-01), Hood et al.
patent: 6212074 (2001-04-01), Gonsalves et al.
patent: 6625021 (2003-09-01), Lofland et al.
patent: 03096260 (1991-04-01), None
Cpumate Inc.
Flanigan Allen J.
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