Integrated heat-dissipating module

Details Integrated heat-dissipating module Integrated heat-dissipating module

2005-06-14

2005-06-14

Feild, Lynn (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S703000, C361S690000, C257S722000, C165S080300, C165S121000

Reexamination Certificate

active

06906922

ABSTRACT:
An integrated heat-dissipating module includes a heat-dissipating device substantially in contact with a main heat-generating source on a motherboard, a casing capping over the main heat-generating source and substantially in contact with sub heat-generating sources installed around the main heat-generating source, and a heat-dissipating fan installed on a first vent of the casing. The heat produced by the main heat-generating source is transmitted to the air inside the casing via the heat-dissipating device. Then, the hot airflow concentrated within the casing is expelled from a second vent of the casing by the heat-dissipating fan. The casing is made of a high heat conducting material and has a plurality of external heat-dissipating fins extending outward from an outer surface of the casing for quickly transmitting the heat generated by the sub heat-generating sources to the outside. Heat produced by the main heat-generating source and the sub heat-generating sources is dissipated simultaneously.

REFERENCES:
patent: 6023413 (2000-02-01), Umezawa
patent: 6091603 (2000-07-01), Daves et al.
patent: 6330906 (2001-12-01), Wang
patent: 6396693 (2002-05-01), Shih
patent: 6711016 (2004-03-01), Chung et al.
patent: 6763881 (2004-07-01), Wagner et al.
patent: 6832410 (2004-12-01), Hegde
patent: 2002/0024796 (2002-02-01), Shih

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