Integrated heat dissipating assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S699000, C361S701000, C361S703000, C165S080400, C165S185000, C257S714000, C062S259200

Reexamination Certificate

active

07466550

ABSTRACT:
An integrated heat dissipating assembly includes two heat sinks, a heat dissipating fan mounted between the two sinks and a body provided below the two heat sinks and the heat dissipating fan. The body is composed of a hollow body, a pump received inside the hollow body and a base attached to a bottom face of the hollow body for conducting heat from a heat source. The hollow body is divided into receiving spaces respectively communicating with water channels of the two heat sinks such that cooling water flowing inside the hollow body and the water channels of the two heat sinks is able to take away heat from the base. The heat is then dissipated by cool air due to the heat dissipating fan.

REFERENCES:
patent: 5121788 (1992-06-01), Carollo
patent: 6019165 (2000-02-01), Batchelder
patent: 6668911 (2003-12-01), Bingler
patent: 6894899 (2005-05-01), Wu et al.
patent: 6945315 (2005-09-01), Gektin et al.
patent: 7100677 (2006-09-01), Lee et al.
patent: 7114551 (2006-10-01), Matsushita et al.
patent: 7273092 (2007-09-01), Huang et al.
patent: 2004/0052048 (2004-03-01), Wu et al.
patent: 2004/0125561 (2004-07-01), Gwin et al.
patent: WO0165900 (2001-09-01), None

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