Integrated electronic structure

Details Integrated electronic structure Integrated electronic structure

1999-07-29

2001-10-16

Dougherty, Thomas M. (Department: 2834)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

C310S31300R

Reexamination Certificate

active

06304020

ABSTRACT:

TECHNICAL FIELD
This invention relates to an integrated electronic structure using piezoelectric material and bonded interdigital arrays. More particularly the invention is directed towards utilising different properties of the piezoelectric material to perform different functions within the same structure.
BACKGROUND ART
The process of using the piezoelectric properties of a material in combination with bonded electrodes in the form of interdigital arrays for the control or processing of electrical signals is well known. Surface acoustic wave (‘SAW’) devices such as resonators, delay lines, filters or convolvers are in widespread use throughout the world. The vast majority use quartz as the piezoelectric material, however other materials in use include directionally orientated zinc oxide and aluminium nitride. These devices are usually discrete devices in their own enclosure supported and connected to other components by a printed circuit board or wires.
The process of using the dielectric properties of a base material is also well known. Capacitors, inductors or high frequency transmission lines are often etched into printed circuit boards along with other conductive tracks. The dielectric properties of the base integrated electronic structure material of the printed circuit board is utilised in this case.
The object of this invention is to address the case where a number of electrical elements are needed in a circuit, some items requiring piezoelectric properties to function and some elements requiring dielectric properties to function.
SUMMARY OF INVENTION
The present invention is an integrated electronic structure comprising an electrically conductive base member with a layer of piezoelectric material bonded thereon, characterised in that at least first and second interdigital arrays are bonded to said layer, in use said first interdigital array relying on the piezoelectric properties of said layer and said second interdigital array relying on the dielectric properties of said layer.
Preferably said first interdigital array forms part of at least one oscillator, such as a surface acoustic wave (‘SAW’) resonator, a shallow bulk acoustic wave (‘SBAW’) resonator, or the like.
Preferably said second interdigital array forms part of at least one directional coupler such as a Lange coupler.


REFERENCES:
patent: 3978436 (1976-08-01), Alig et al.
patent: 3982113 (1976-09-01), Coldren
patent: 4392115 (1983-07-01), Volluet et al.
patent: 5891251 (1999-04-01), Taguchi et al.
patent: 05167384A (1993-10-01), None
Japanese Abstract, vol. 017, No. 570 (E-1448), dated Oct. 15, 1993, & JP 05 167384 A (Hitachi Ltd), dated Jul. 2, 1993.
Japanese Abstract, vol. 005. No. 091 (E-061), dated Jun. 13, 1981 & JP 56 037722 A (Murata Mfg. Co., Ltd), dated Apr. 11, 1981.

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