Integrated electronic device having flip-chip connection with ci

Details Integrated electronic device having flip-chip connection with ci Integrated electronic device having flip-chip connection with ci

1996-12-19

1999-11-02

Kelley, Nathan K.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257738, H01L 2348

Patent

active

059776374

ABSTRACT:
An integrated electronic device having an electric connection between a first electrode of a semiconductor chip and a second electrode of a circuit board. One embodiment according to the present invention is a method for fabricating an integrated electronic device having an electric connection between a first electrode of a semiconductor chip and a second electrode of a circuit board, both surfaces of the first and second electrodes having an adhesive tendency to molten metal, the method comprising the steps of forming a metal bump on the first electrode, the metal bump being made of a soldering metal alloy consisting of a solid phase component and a liquid phase component at an operating temperature; and forming an electric connection between the first electrode and the second electrode by heating the soldering metal alloy so as to adhere to the surface of the second electrode.

REFERENCES:
patent: 5376584 (1994-12-01), Agarwala
patent: 5859470 (1999-01-01), Ellerson et al.
Zequn Mei, Low-Temperature Solders, Hewlett-Packard Journal p. 91, Aug. 1996.

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