Integrated electronic component

Details Integrated electronic component Integrated electronic component

2006-10-24

2006-10-24

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C361S752000

Reexamination Certificate

active

07126057

ABSTRACT:
An integrated electronic component includes a ceramic substrate incorporating circuit elements and/or having circuit elements mounted thereon, and a metal case mounted on the ceramic substrate. Notches are formed in substrate-facing segments of the metal case at the positions opposing the corners of the top surface of the ceramic substrate. The notches have a tapered shape having obtuse angles with respect to the top surface of the substrate. The notches may have a substantially circular arc shape. The substrate-facing segments having the notches are seamlessly connected to side segments of the metal case, bent in the vicinity of the notches, and supported by the bent portions in a cantilevered fashion.

REFERENCES:
patent: 4841414 (1989-06-01), Hibino et al.
patent: 6079099 (2000-06-01), Uchida et al.
patent: 6687135 (2004-02-01), Kitade
patent: 6694610 (2004-02-01), Kitade
patent: 6788545 (2004-09-01), Nakayama
patent: 2002-353071 (2002-12-01), None

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