Integrated electronic circuit

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

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Details

257691, 257668, 257664, 257685, 257728, 257706, 333204, H01L 2940, H01P 115, H05K 100

Patent

active

059295104

ABSTRACT:
An electronic integrated circuit which includes at least one of RF, microwave, digital and analog components connected in a desired circuit. The integrated circuit includes a substrate of a conductive material having on a surface thereof a body of a dielectric material. The dielectric body is formed of a plurality of layers of the dielectric material bonded together. A plurality of strips of a conductive material are on the surfaces of the layers of the body to form RF, analog and digital components. Discrete electronic devices are mounted on the body and connected in the circuit. Vias of a conductive material extend through the various layers of the body to electrically connect the various strips of conductive material on the layers of the body.

REFERENCES:
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patent: 5387888 (1995-02-01), Eda et al.
patent: 5559363 (1996-09-01), Immorlica, Jr.
patent: 5654681 (1997-08-01), Ishizaki et al.
patent: 5783976 (1998-07-01), Furutani et al.

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