Integrated electro-optical package and method of fabrication

Details Integrated electro-optical package and method of fabrication Integrated electro-optical package and method of fabrication

1998-07-20

2000-02-08

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438106, 438121, 438116, H01L 2144, H01L 2148, H01L 2150

Patent

active

060227605

ABSTRACT:
An integrated electro-optical package including a dual sided opto-electronic device, composed of a substrate with an array of light emitting devices (LEDs) formed on a first major surface thereof, and at least one vertical cavity surface emitting laser formed on an opposed second major surface of the substrate. A mounting structure formed so as to allow for the mounting of the dual sided opto-electronic device on the interior major surfaces, and further having electrical conductors for cooperating with the LEDs and VCSEL of the opto-electronic device. A driver substrate having electrical connections for interfacing with the mounting structure and the dual sided opto-electronic device. A plurality of driver circuits connected to the mounting structure and dual sided opto-electronic device through connection pads formed on the driver substrate.

REFERENCES:
patent: 5283447 (1994-02-01), Olbright et al.
patent: 5500540 (1996-03-01), Jewell et al.
patent: 5606572 (1997-02-01), Swirhun et al.
patent: 5837561 (1998-11-01), Kish, Jr. et al.

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