Integrated electro-optical package

Details Integrated electro-optical package Integrated electro-optical package

1995-04-03

1997-11-18

Hjerpe, Richard

Computer graphics processing and selective visual display system

Plural physical display element control system

Display elements arranged in matrix

257 81, 257 88, 257 98, 257 99, 361806, 361820, G09G 332, H01L 3300

Patent

active

056892799

ABSTRACT:
An integrated electro-optical package including a semiconductor chip with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the chip. A window frame substrate having a central opening therethrough coextensive with the real image generated by the chip and mounting pads, bump bonded to the pads on the chip. A plurality of driver circuits connected to the light emitting devices through terminals on the window frame substrate. A lens mounted to the substrate over the opening and on a side opposite the chip to magnify the real image and produce an easily viewable virtual image.

REFERENCES:
patent: 3940846 (1976-03-01), Grenon
patent: 4445132 (1984-04-01), Ichikawa et al.
patent: 4933601 (1990-06-01), Sagawa et al.

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