Integrated electro-optical package

Details Integrated electro-optical package Integrated electro-optical package

1994-03-24

1995-07-11

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

In combination with or also constituting light responsive...

257 88, 257 98, 257 99, 361806, 361820, H01L 3300, H01L 2302

Patent

active

054323584

ABSTRACT:
An integrated electro-optical package including a semiconductor chip with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the chip. A window frame substrate having a central opening therethrough coextensive with the real image generated by the chip and mounting pads, bump bonded to the pads on the chip. A plurality of driver circuits connected to the light emitting devices through terminals on the window frame substrate. A lens mounted to the substrate over the opening and on a side opposite the chip to magnify the real image and produce an easily viewable virtual image.

REFERENCES:
patent: 3940846 (1976-03-01), Grenon
patent: 4933601 (1990-06-01), Sagawa et al.

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