Integrated electro-optical package

Details Integrated electro-optical package Integrated electro-optical package

1996-06-10

1997-12-30

Whitehead, Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

257431, 257432, 257433, 257774, 257 81, 257 82, 257 79, H01L 310203, H01L 31115, H01L 2715, H01L 3112

Patent

active

057033943

ABSTRACT:
An integrated electro-optical package including a plurality of organic light emitting devices (LEDs) directly interconnected to external driver circuits utilizing a printed circuit board, having formed therein a plurality of plated through-hole vias and a method of fabricating the integrated electro-optical package. The organic LEDs are fabricated on a supporting substrate and include vertical interconnections to driver and control circuits mounted on an uppermost surface of a printed circuit board (PCB). The vertical interconnections are formed utilizing plated through-hole conductive vias formed in the printed circuit board, conductive leads, and conductive epoxy. A hermetic seal is formed by positioning a sealing ring formed on the printed circuit board in sealing contact with a sealing area on the surface of the substrate so as to hermetically seal the organic light emitting devices.

REFERENCES:
patent: 5164994 (1992-11-01), Bushroe
patent: 5274224 (1993-12-01), Poujois
patent: 5529441 (1996-06-01), Kosmowski et al.

Affiliated with

Also associated with

Rating

Integrated electro-optical package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated electro-optical package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated electro-optical package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-205178