Integrated dielectric substrate

Details Integrated dielectric substrate Integrated dielectric substrate

1997-09-18

1999-11-30

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257707, 361711, H05K 720

Patent

active

059953713

ABSTRACT:
An integrated dielectric substrate has a dissipating plate for dissipating the heat generated by an exothermic element mounted above the surface of the dielectric substrate. Either a cavity or a groove is cut through the surface of the dielectric substrate, preferably from one end to the other end of the dielectric substrate, the dissipating plate being fitted in the cavity or groove, both ends of the dissipating plate extending beyond the corresponding ends of the dielectric substrate to form extending end portions, and the exothermic element being mounted on the surface of the dissipating plate.

REFERENCES:
patent: 4630172 (1986-12-01), Stenerson
patent: 4729061 (1988-03-01), Brown
patent: 4812949 (1989-03-01), Fontan
patent: 4859805 (1989-08-01), Kawakami
patent: 4866571 (1989-09-01), Butt
patent: 5583377 (1996-12-01), Higgins, III
patent: 5629835 (1997-05-01), Mahulikar
patent: 5731067 (1998-03-01), Asai

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