Integrated die level isolation for a MEMS device

Details Integrated die level isolation for a MEMS device Integrated die level isolation for a MEMS device

2007-10-09

2007-10-09

Schwartz, Jordan (Department: 2873)

Optical: systems and elements

Optical modulator

Light wave temporal modulation

C359S315000

Reexamination Certificate

active

11420073

ABSTRACT:
A Microelectromechanical Systems (MEMS) package having a housing and a MEMS device bonded within the cavity of the housing. The MEMS device includes a MEMS sensor and a base connected to the MEMS sensor at a first surface. The base includes a first support device that is collocated with the MEMS sensor and a second support device is partially physically isolated from the first support device. An attachment device attaches the second support device to a base surface of the housing. The second support device is isolated from the first support device by one or more cavities. The second support device includes a plurality of posts located adjacent to edges of the base. The plurality of posts include four corner posts and four side posts, each of the four corner posts are separated from two of the four side posts by two of the cavities.

REFERENCES:
patent: 5837562 (1998-11-01), Cho
patent: 6806557 (2004-10-01), Ding
patent: 6929974 (2005-08-01), Ding et al.
patent: 2005/0023629 (2005-02-01), Dink et al.

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