Integrated devices with optical and electrical isolation and...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Having diverse electrical device

Reexamination Certificate

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C438S048000, C438S400000, C257S510000

Reexamination Certificate

active

10701534

ABSTRACT:
The invention is directed to a method for optical and electrical isolation between adjacent integrated devices. The method comprises the steps of forming at least one trench through an exposed surface of a semiconductor wafer by removing a portion of the semiconductor wafer material, forming an electrically insulating layer on the sidewalls and the bottom of the at least one trench, filling the at least one trench by conformally depositing an optically isolating material, and planarizing the semiconductor wafer surface by removing the portion of the optically isolating material above the exposed surface of the semiconductor wafer.

REFERENCES:
patent: 5394005 (1995-02-01), Brown et al.
patent: 5498566 (1996-03-01), Lee
patent: 5763315 (1998-06-01), Benedict et al.
patent: 6063693 (2000-05-01), Soderbarg et al.
patent: 6146970 (2000-11-01), Witek et al.
patent: 6239001 (2001-05-01), Takaishi
patent: 6239434 (2001-05-01), Brown
patent: 6294820 (2001-09-01), Lucas et al.
patent: 6303413 (2001-10-01), Kalnitsky et al.
patent: 6547146 (2003-04-01), Meksavan et al.
patent: 6607967 (2003-08-01), Pallinti et al.
patent: 2002/0066960 (2002-06-01), Ring
patent: 2002/0074556 (2002-06-01), Kwak et al.
patent: 2003/0013270 (2003-01-01), Seitz
patent: 2004/0089914 (2004-05-01), Mouli et al.
patent: 2004/0175897 (2004-09-01), Wensley et al.
M. Nandakumar, A. Chatterjee, S. Sridhar, J. Joyner, M. Rodder and I.-C.Chen, “Shallow Trench Isolation for Advanced ULSI CMOS Technologies,” IEEE International Electron Devices Meeting, IEDM '98 Technical Digest., pp. 133-136 (1998).
Dale M. Brown, Evan T. Downey, Mario Ghezzo, James W. Kretchmer, Richard J. Saia, Yung S. Liu, John A. Edmond, George Gati, Joseph M. Pimbley and William E. Schneider, “Silicon Carbide UV Photodiodes,” IEEE Transactions on Electron Devices, vol. 40, No. 2, Feb. 1993, p. 325-333.
Dale M. Brown, Evan Downey, Jim Kretchmer, Gerald Michon, Emily Shu and Don Schneider, “SiC Flame Sensors for Gas Turbine Control Systems,” Solid-State Electronics, vol. 42, No. 5, p. 755-760 (1998).

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