Integrated coupling structures

Details Integrated coupling structures Integrated coupling structures

2011-04-05

2011-04-05

Dougherty, Thomas M (Department: 2837)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

C310S026000, C310S309000

Reexamination Certificate

active

07919909

ABSTRACT:
An integrated package provides contactless communication through a coupling mechanism embedded in the package. Package types include Surface Mount Technology (SMT), Low Temperature Co-fired Ceramic (LTCC) technology, and dual-in-line integrated circuit pressed ceramic packages generally. The package can include an acoustic wave device (AWD) sensor such as a surface acoustic wave (SAW) device or a bulk acoustic wave (BAW) device. Coupling includes inductive and capacitive effects through plates, loops, spirals, and coils. Coil inductance and SAW capacitance can be parallel resonant at the desired SAW resonance with the coil impedance higher than the SAW impedance, minimizing load-pull effects.

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