Package making – Methods – Forming or partial forming a receptacle and subsequent filling
Patent
1995-05-01
1997-09-30
Coan, James F.
Package making
Methods
Forming or partial forming a receptacle and subsequent filling
53426, 53561, B65B 2900, B65B 3100, B65B 5524
Patent
active
056715919
ABSTRACT:
This invention is an integrated system for making containers and filling them with ultra high purity chemicals all within a cleanroom environment so that the chemicals avoid contamination and meet semiconductor manufacturing purity standards.
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Characterization of Polyethylene as a Packaging Material for High Purity Process Chemicals Thomas B. Hackett and Keith D. Dillenbeck, Ashland Chemical Company May 2-7, 1993.
Understanding the Particle Shedding Phenomena in Polyethylene Containers for Semiconductor Process Chemicals Thomas B. Hackett and Keith D. Dillenbeck, Ashalnd Chemical Company 1991.
Packaging High Purity Chemicals to Ensure Low Particulate Contamination At Point-of-Use Thomas B. Hackett and Stephen S. Hupp, Ashland Chemical Company 1990.
Determination of Leachable metallic Impurities from Semiconductor Chemical Packaging Material Tom Talasek, Lindsey Hall, Leanne Mallini, Valerie Sewall Microcontamination 94 Conference, Oct. 4-6, 1994.
Identifying Organic Impurities in Inorganic Process Chemicals by Solid-Phase Extraction Tom Talasek, Lynn Vanatta, Brenda Lucero and Tricia Schoenke Microcontamination Jun. 1993.
Determination of Trace Organic Impurities in Semiconductor Processing Chemicals Mark J. Camenzink, Marjorie K. Balazs Microcontamination Conference Proceedings, Oct. 16-18, 1991.
Ashland Inc.
Coan James F.
PIcken Mary E.
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