Integrated connector and positive thermal coefficient switch

Details Integrated connector and positive thermal coefficient switch Integrated connector and positive thermal coefficient switch

2001-12-20

2004-10-26

Vortman, Anatoly (Department: 2835)

Electricity: electrothermally or thermally actuated switches

Electrothermally actuated switches

Fusible element actuated

C337S188000, C337S297000, C439S620180, C439S620180

Reexamination Certificate

active

06809625

ABSTRACT:

FIELD
The invention relates to an integrated connector and positive thermal coefficient switch. More particularly, the present invention is a connector that is used to communicate with or supply power to a printed circuit board in which the connector has a positive thermal coefficient switch contained therein.
BACKGROUND
In the rapid development of computers many advancements have been seen in the areas of processor speed, throughput, communications, and fault tolerance. Today an entire computer can fit into the palm of a hand that are known as palm computers and personal digital assistants do. In a larger cabinet peripherals may also be included in the computer system that once filled entire rooms. However, regardless of size of the cabinet or the usage a printed circuit board serves, space is always at a premium on a printed circuit board. This would particularly be the case for a baseboard (motherboard) in which a microprocessor, memory, communications interface, and peripheral interfaces are attached thereto. However, it would also be the case for the peripheral and communication's interfaces that would often be placed on separate boards. Further, the printed circuit board serves the primary function of establishing communications between chips placed on the printed circuit board and possibly other boards. Therefore, a paramount concern in printed circuit board design is the communications and power lines and their layout on the surface of the printed circuit board or in the embedded layers of the printed circuit board and communications between one layer and another in the printed circuit board.
FIG. 1A
is an example of a side view of a printed circuit board (PCB)
10
having a connector
30
and surface mounted positive thermal coefficient switches
20
contained therein. The positive thermal coefficient switch
20
is required to cut off power or communications in a connector lead (not shown) when the amount of current passing through the connector lead exceeds the thermal coefficient of the positive thermal coefficient switch
20
. These positive thermal coefficient switches
20
are required in an order to protect the circuitry on the printed circuit board
10
.
FIG. 1B
is an example of a side view of a printed circuit board
10
having a through hole mount (THM) embedded positive thermal coefficient switch
20
.
FIG. 1B
is similar to
FIG. 1A
with the exception that
FIG. 1B
has the positive thermal crustaceans switch
20
through the printed circuit boad
10
. Therefore, no further discussion of
FIG. 1B
will be provided here.
FIG. 2
is an example of a top view of a printed circuit board
10
having a through hole or surface mounted positive thermal coefficient switches
20
. In this figure several leads/traces
40
are connected to the connector
30
and are either through the printed circuit board
10
or on the surface thereof. Attached to the numerous leads/traces
40
are positive thermal coefficient switches
20
which are either through or surface mounted. As indicated in the figure, not all leads/traces
40
have a positive thermal coefficient switch
20
attached thereto. However, each positive thermal coefficient switch
20
takes up space either in or on the printed circuit board
10
and further obstructs the close placement of lead/traces
40
.
FIG. 3
is an example of a top view of a printed circuit board
10
having an embedded or surface mounted positive thermal coefficient switches
20
.
FIG. 3
is similar to
FIG. 2
, with the exception that three leads/traces
40
interconnect prior to entering connector
30
. It should further be noted that in spite of a common connection each individual lead/traces
40
is required to have its own positive thermal coefficient switch
20
. This adds to the space required for positive thermal coefficient switches
20
on the printed circuit board
10
and also limits the number of lead/traces
40
which can be placed adjacent to each other on the printed circuit board
10
.
Therefore, what is required is a device that will eliminate the need to for positive thermal coefficient switches being placed on the surface of or through a printed circuit board. This device should free up space on the printed circuit board and enable a higher concentration of leads/traces being placed on an embedded printed circuit board.


REFERENCES:
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WEBSTER'S New Riverside University Dictionary, copy of p. 1070, 1071 (fragments).

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