Integrated connection arrangements

Details Integrated connection arrangements Integrated connection arrangements

2006-02-09

2009-11-17

Rose, Kiesha L (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C438S618000, C257SE23012, C257SE21508

Reexamination Certificate

active

07619309

ABSTRACT:
A connection arrangement having an outer conductive structure arranged at least partly or completely in a cutout of an electrical insulation layer is provided. An inner conductive structure is arranged at the bottom of the cutout on one side of the insulation layer. The inner conductive structure adjoins the outer conductive structure in a contact zone. A contact area is arranged at the outer conductive structure on the other side of the cutout. The contact zone and the contact area do not overlap. The bottom of the cutout is arranged to overlaps at least half of the contact area, to provide a step in the insulation layer at the edge of the cutout outside a main current path between the contact area and the inner conductive structure.

REFERENCES:
patent: 5169680 (1992-12-01), Ting et al.
patent: 5525544 (1996-06-01), Kariyazono et al.
patent: 5904556 (1999-05-01), Suzuki et al.
patent: 5969424 (1999-10-01), Matsuki et al.
patent: 6249532 (2001-06-01), Yoshikawa et al.
patent: 6287893 (2001-09-01), Elenius et al.
patent: 6300234 (2001-10-01), Flynn et al.
patent: 6429532 (2002-08-01), Han et al.
patent: 6451681 (2002-09-01), Greer
patent: 6500750 (2002-12-01), Shroff et al.
patent: 6559548 (2003-05-01), Matsunaga et al.
patent: 6650002 (2003-11-01), Toyosawa et al.
patent: 6713870 (2004-03-01), Fang
patent: 6720212 (2004-04-01), Robl et al.
patent: 6734047 (2004-05-01), Daubenspeck et al.
patent: 6768199 (2004-07-01), Yoon et al.
patent: 6803302 (2004-10-01), Pozder et al.
patent: 6908841 (2005-06-01), Burrell et al.
patent: 7247943 (2007-07-01), Scheucher
patent: 7294565 (2007-11-01), Burrell et al.
patent: 7301244 (2007-11-01), Tsutsui et al.
patent: 7397125 (2008-07-01), Oda
patent: 2002/0016070 (2002-02-01), Friese
patent: 2002/0093098 (2002-07-01), Barr et al.
patent: 2003/0015802 (2003-01-01), Watanabe
patent: 2003/0080428 (2003-05-01), Izumitani et al.
patent: 2004/0032024 (2004-02-01), Lee et al.
patent: 2004/0150112 (2004-08-01), Oda
patent: 2004/0235223 (2004-11-01), Lai et al.
patent: 2005/0093176 (2005-05-01), Hung et al.
patent: 2005/0121804 (2005-06-01), Kuo et al.
patent: 2000-340569 (2000-12-01), None
patent: 2002-313910 (2002-10-01), None
patent: 2003179059 (2003-06-01), None
patent: WO 03/003458 (2003-01-01), None
Translation of Japanese Office Action dated Jun. 16, 2009; Patent Application No. 2006-523006.

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