Boots – shoes – and leggings
Patent
1990-09-28
1997-11-18
Ramirez, Ellis B.
Boots, shoes, and leggings
364492, H01L 2900
Patent
active
056894287
ABSTRACT:
An integrated circuit includes conductive elements and a radiation sensitive material interposed between the conductive elements and dosed to different conductivities in different portions thereof. Another aspect is a process of integrated circuit fabrication including steps of depositing a radiation sensitive material as a layer and variably dosing it with radiation to establish areas of higher and lower resistivity in the layer. A printed wiring board includes radiation sensitive material and the board further has a conductor layer affixed to the base. A transistor has a radiation sensitive material dosed to have two conductive regions separated by a gap of a lower conductivity in the radiation sensitive material, and a conductive substance deposited over the gap. These elements are useful in smart power devices, digital computers, controllers and electronic applications generally. Other devices, systems and processes are disclosed.
REFERENCES:
patent: 3816163 (1974-06-01), Yoldas
patent: 4098654 (1978-07-01), Helle et al.
patent: 4702792 (1987-10-01), Chow et al.
patent: 4707394 (1987-11-01), Chant
patent: 4733383 (1988-03-01), Waterbury
patent: 4772804 (1988-09-01), Grimaud et al.
patent: 4839219 (1989-06-01), Uekita et al.
patent: 4843034 (1989-06-01), Herndon et al.
patent: 4853277 (1989-08-01), Chant
patent: 4863833 (1989-09-01), Fukuyama et al.
patent: 4906966 (1990-03-01), Imamura et al.
patent: 5100762 (1992-03-01), Tanaka et al.
patent: 5119312 (1992-06-01), Groger et al.
patent: 5376502 (1994-12-01), Novak et al.
J. Beard, "Quick-change plastic may make for cheaper chips", New Scientist, (1990) 15 Sep. No. 1734, Haywards Heath, GB, p. 36.
"Research Notes", Electronics & Wireless World, (1988) Dec., No. 1634, Sutton, Sussey, Gr. Britain, p. 1241.
Chemical Abstracts, vol. 103, 1985, p. 24.
Brief, "Variable-Resistivity Material for Memory Circuits", single page, NASA's Jet Propulsion Laboratory, 2301 NTIS Tech Notes (1990) Apr., Springfield, VA. US.
K. Mukai et al., "Planar Multilevel Interconnection Technology Employing a Polyimide" IEEE vol. SC-13, No. 4, Aug. 1978 pp. 462-467.
M Monnler, "Circuiterie Sur Film Polyimide", Tont L'Electronique Aug.-Sep. 1979 pp. 25-30.
Engineer-in-Training Reference Manual, Lindeburg, pp. 51-57, 1990.
Sauerbrey Roland
Smayling Michael C.
Donaldson Richard L.
Kemper M.
Matsil Ira S.
McCormack Brian C.
Ramirez Ellis B.
LandOfFree
Integrated circuits, transistors, data processing systems, print does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuits, transistors, data processing systems, print, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuits, transistors, data processing systems, print will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1570348