Integrated circuits; methods for manufacturing an integrated...

Details Integrated circuits; methods for manufacturing an integrated... Integrated circuits; methods for manufacturing an integrated...

2007-09-17

2010-11-23

Smith, Bradley K (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Bulk effect device

Bulk effect switching in amorphous material

C257S003000, C257S004000, C257S005000, C257SE29002, C438S102000, C438S103000, C365S163000

Reexamination Certificate

active

07838861

ABSTRACT:
Embodiments of the present invention relate generally to integrated circuits, to methods for manufacturing an integrated circuit and to a memory module. In an embodiment of the invention, an integrated circuit is provided having a programmable arrangement. The programmable arrangement includes a substrate having a main processing surface, at least two first electrodes, wherein each of the two first electrodes has a side surface being arranged at a respective angle with regard to the main processing surface, the side surfaces facing one another. The programmable arrangement may further include at least one second electrode and ion conducting material between each of the at least two first electrodes and the at least one second electrode, wherein the at least one second electrode is arranged partially between the side surfaces of the two first electrodes facing one another.

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patent: 10 2004 031 135 (2006-01-01), None
patent: 10 2006 020 179 (2007-11-01), None

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