Patent
1988-05-18
1990-04-10
Hille, Rolf
357 17, 357 55, 357 30, 350 962, 350 9611, 350 9615, 350 9617, H01L 3112, H01L 3116
Patent
active
049164970
ABSTRACT:
Integrated circuits are formed by bonding two substrates together on a moat or recess. If the moat is exposed at a side wall, an optical fiber is inserted therein and communicates optically with a photoelectric device in the substrate by a slant side wall of the moat. If the moat is sealed by a cover layer resulting from removing all or most of the top substrate leaving the bonding layer as a cover, a pressure responsive device is formed on the cover layer directly or in the remaining top substrate over the sealed cavity.
REFERENCES:
patent: 3864019 (1975-02-01), Smolinsky et al.
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patent: 4210923 (1980-07-01), North et al.
patent: 4549338 (1985-10-01), Abend et al.
patent: 4756590 (1988-07-01), Forrest et al.
patent: 4760569 (1988-07-01), Mahlein
"Pressure Sensitivity in Anisotropically Etched Thin-Diaphragm Pressure Sensors" Clark et al., IEEE Transactions, vol. ED-26, No. 12, Dec. 1979, p. 1887.
"Micro-Diaphragm Pressure Sensor", Sugiyama et al., IEDM-86, IEEE, p. 184.
"Scaling Limits in Batch-Fabricated Silicon Pressure Sensors", Chau et al., IEEE Transactions, vol. ED-34, No. 4, Apr. 1987, p. 850.
"Fabrication Techniques for Integrated Sensor Microstructures", Guckel et al., IEDM-86, IEEE, p. 176.
Gaul Stephen J.
McLachlan Craig J.
Harris Corporation
Hille Rolf
Tran Minh Loan
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