Integrated circuits having improved fusible links

Details Integrated circuits having improved fusible links Integrated circuits having improved fusible links

1990-07-25

1991-06-18

Carroll, J.

357 54, 357 65, H01L 2934, H01L 2702, H01L 2348

Patent

active

050253000

ABSTRACT:
An integrated circuit includes a conductive fusible link (14) that may be blown by laser energy. The dielectric material (15) covering the fuse is etched away to expose the fuse. A protective dielectric layer (30) is formed on the fuse to a controlled thickness less than that of the interlevel dielectric. The resulting structure prevents shorts between conductors that might otherwise occur due to debris from the fuse-blowing operation, and provides protection to the integrated circuit. In addition, the fuse blowing operation is more consistent from fuse to fuse.

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patent: 4455194 (1984-06-01), Yabu et al.
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patent: 4692190 (1987-09-01), Komatsu
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patent: 4774561 (1988-09-01), Takagi
patent: 4795720 (1989-01-01), Kawanabe et al.
patent: 4853758 (1989-08-01), Fischer
"Process and Structure for Laser Fuse Blowing", IBM Technical Disclosure Bulletin, vol. 31 (May 1989), p. 93.
U.S. patent application Ser. No. 07/084531 (F. H. Fischer Case 3).

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