Integrated circuits and a method for manufacture thereof

Details Integrated circuits and a method for manufacture thereof Integrated circuits and a method for manufacture thereof

1989-12-07

1990-10-02

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437203, 437195, 437228, 437 19, 437174, H01L 21283

Patent

active

049607294

ABSTRACT:
A technique for providing a radiation formable conductive link in an integrated circuit comprising the steps of: depositing a plurality of aluminum conductors on an exposed surface of an otherwise completed integrated circuit, and forming a bridge of amorphous silicon layer joining the aluminum conductors at selected locations, whereby subsequent laser radiation produces diffusion of aluminum into the amorphous silicon, producing a highly conductive aluminum doped silicon bridge.

REFERENCES:
patent: 4455194 (1984-06-01), Yabu et al.
patent: 4536949 (1985-08-01), Takayama et al.
patent: 4561906 (1985-12-01), Calder
patent: 4585490 (1986-04-01), Raffel
patent: 4602420 (1986-07-01), Saito
patent: 4617723 (1986-10-01), Mukai
patent: 4636404 (1987-01-01), Raffel
patent: 4685295 (1987-05-01), McDavid
patent: 4720908 (1988-01-01), Wills
patent: 4740485 (1988-04-01), Sharpe-Geisler
patent: 4751197 (1988-06-01), Wills
patent: 4797108 (1989-01-01), Crowther
patent: 4800179 (1989-01-01), Mukai
patent: 4808552 (1989-02-01), Anderson
patent: 4832789 (1989-05-01), Cochran
patent: 4866009 (1989-09-01), Matsuda
Raffel et al., "Laser Programmed Vias . . . ", IEDM, 12/80, pp. 132-135.
D. Platteter, IEEE Reliability Physics Symposium, 1976, p. 248.
J. Melnagalis et al., J. Nac. Sci. Technol., B4 (1), Jan. 1986, p. 176.
J. C. Logue et al., IBM J. Res. Develop., 25(3), May 1981, p. 107.
J. I. Raffel et al., "Laser-Formed Connections Using Polyimide", Appl. Phys. Lett., 42(8), Apr. 15, 1983.
J. A. Yasaitis et al., Low Resistance Laser Formed Lateral Links, IEEE Electron Device Letters, vol. EDL-3, No. 7, Jul. 1982.
J. I. Raffel et al., A Wafer-Scale Digital Integrator Using Restructable VSLI, IEEE Journal of Solid-State Circuits, vol. SC-20, No. 1, Feb. 1985, pp. 399-401.

Affiliated with

Also associated with

Rating

Integrated circuits and a method for manufacture thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuits and a method for manufacture thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuits and a method for manufacture thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-292328