Integrated circuitry with interconnection pillar

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257756, 257903, 257377, 257382, 257385, H01L 2348, H01L 2352, H01L 2976, H01L 2994

Patent

active

057010366

ABSTRACT:
A semiconductor processing method includes: a) providing a substrate having a base region to which electrical connection is to be made; b) providing a first layer of a conductive first material; c) providing an etch stop layer over the first layer; d) etching a contact opening through the etch stop and first layers to the base region; e) providing a second layer of first material outwardly of the etch stop layer and within the contact opening to a thickness greater than the first layer thickness and extending outwardly beyond the contact opening upper edge; f) removing first material of the second layer and defining a second layer plug within the contact, the second layer plug having an outermost surface extending outwardly beyond the contact opening upper edge and thereby providing the second layer plug to be of greater thickness than the first layer; g) masking outwardly of the first layer and the second layer plug to define a mask pattern for definition of a circuit component from the first layer which connects with the base region through the second layer plug; and h) etching unmasked portions of the first layer and second layer plug to define a circuit component which connects with the base region through the second layer plug, the greater thickness of the second layer plug as compared to the thickness of the first layer restricting etching into the base region during etching. Integrated circuitry is also disclosed.

REFERENCES:
patent: 4176003 (1979-11-01), Brower et al.
patent: 4178674 (1979-12-01), Liu et al.
patent: 4240196 (1980-12-01), Jacobs et al.
patent: 4394406 (1983-07-01), Gardiner et al.
patent: 4516147 (1985-05-01), Komatsu et al.
patent: 4897704 (1990-01-01), Sakurai
patent: 4975381 (1990-12-01), Taka et al.
patent: 5126231 (1992-06-01), Levy
patent: 5162259 (1992-11-01), Kolar et al.
patent: 5243220 (1993-09-01), Shibata et al.
patent: 5292676 (1994-03-01), Manning
patent: 5326713 (1994-07-01), Lee

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuitry with interconnection pillar does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuitry with interconnection pillar, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuitry with interconnection pillar will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1804252

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.