Integrated circuit with variable pad pitch

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular chip input/output means

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257202, 257796, 257784, 438128, H01L 2710, H01L 2348, H01L 2352

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active

057420793

ABSTRACT:
A method for making an integrated circuit characterized by: determining a range of bonding pad pitches which varies between a minimum bonding pad pitch and a maximum bonding pad pitch; setting a driver pitch to the minimum bonding pad pitch; forming a base set including a plurality of drivers having the determined driver pitch; forming customization layers over the base set, where the customization layers include a plurality of bonding pads having a pad pitch greater than the minimum bonding pad pitch but less than or equal to the maximum bonding pad pitch; and coupling some, but not all, of the drivers to the pads. As a result, a single base set can be used to make integrated circuits having a range of bonding pad pitches. The method and structure of the present invention are very well adapted for use in gate array integrated circuits.

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