Integrated circuit with taped heat pipe

Details Integrated circuit with taped heat pipe Integrated circuit with taped heat pipe

1996-09-03

1998-03-10

Rivell, John

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

361704, 257719, 257727, F28D 1500

Patent

active

057250502

ABSTRACT:
The invention is an apparatus for attaching a heat pipe to an integrated circuit or other surface. The heat pipe is held against the flat surface by a heat conducting clamp constructed as a "U" cross section with flanges on the ends of the "U" section, and both the heat pipe and the clamp are held onto the integrated circuit or other surface with heat conductive tape which has adhesive on both its faces. The heat pipe itself can be deformed so that its contact surface also is flat and yields better heat transfer with the integrated circuit.

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patent: 5459352 (1995-10-01), Layton et al.
patent: 5485671 (1996-01-01), Larson et al.
patent: 5560423 (1996-10-01), Larson et al.

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